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| ESD Protection Devices ESD Protection Devices Tyco Electronics' ESD line of devices help protect I/O ports on HDMI 1.3, portable video players, LCD & plasma TVs, USB 2.0, digital visual interface (DVI), and antenna switches. ESD devices shunt electrostatic discharge away from sensitive circuitry in HDTV equipment, printers, laptops, cellular phones, and other portable devices. ESD devices offer many advantages over traditional protection devices, such as multi layer varistors (MLVs), which may degrade or distort the signal in high data rate circuits. Compared to transient voltage suppression (TVS) diodes and miniature gas discharge tubes (GDTs), ESD devices provide a more compact form factor and an economical solution for the shrinking profiles of today's compact information appliances. Available in a range of form factors, our ESD protection devices provide low capacitance, and meet transmission line pulse (TLP) testing, as well as IEC61000-4-2 testing. 7 Features * RoHS compliant * Halogen free (refers to: Br 900ppm, Cl 900ppm, Br+Cl 1500ppm) Benefits * ESD protection for high frequency applications (HDMI 1.3) * Smaller form factor for board space savings * Helps protect sensitive electronic circuits against damage caused by electrostatic discharge (ESD) events * Assists equipment to pass IEC 61000-4-2, level 4 testing * 0.25 pF (typical) capacitance * Low-leakage current * Low-clamping voltage * Fast response time (< 1ns) * Capable of withstanding numerous ESD strikes * Compatible with standard reflow installation procedures * Thick film technology * Bi-directional protection Applications * HDMI 1.3 interfaces * LCD & plasma TV * Cellular phones * Antennas * Portable video players * Portable devices (PDA, DSC, BlueTooth) * Printer ports * Satellite radios * USB 2.0 and IEEE 1394 interfaces * DVI * GPS systems 45 Table E1 Electrical Characteristics for ESD Devices Continuous Max Operating Voltage Symbol Unit PESD0402-140 PESD0603-240 PESD1206Q-240 VDC V 14 24 24 Typical Trigger Voltage* VT(TLP) V 250 215 250 Typical Clamping Voltage VC(TLP) V 40 45 45 Typical Capacitance @1 MHz, 1VRMS CP pF 0.25 0.25 0.25 Typical Leakage Current IL(TYP) A < 0.01 < 0.01 < 0.01 Max Leakage Current @ Max VDC IL(MAX) A 10.0 10.0 10.0 Notes : * TLP test method at 1kV. Measured 30ns after pulse initiation. Typical capacitance value is at 0V and Max Operating Voltage bias. Figure E1 Capacitance vs. Frequency for ESD Devices 0.30 0.28 0.26 0.24 0.22 0.20 0.18 0.16 0.14 0.12 0.10 0.08 0.06 0.04 0.02 0 Capacitance (pF) 0 500 1000 1500 2000 2500 3000 Frequency (MHz) 7 Figure E2 Eye Diagram Performance at 3.4 GHz for ESD Devices Figure E3 Insertion Loss Diagram for ESD Devices 0.1 0 -0.1 Insertion Loss (dB) -0.2 -0.3 -0.4 -0.5 -0.6 -0.7 -0.8 -0.9 -1.0 0.3 1 10 100 -0.1dB at 3.4GHz 1000 6000 Frequency (MHz) 46 RoHS Compliant, ELV Compliant HF Halogen Free ESD Protection Devices Figure E4-E5 ESD Protection for HDMI Figure E4 ESD Protection for HDMI (0402 and 0603) HDMI Port HDMI Transmitter or Receiver TX0+ TX0TX01+ TX01TX02+ TX02TC+ TCHDMI Port Figure E5 ESD Protection for HDMI (1206Q) HDMI Transmitter or Receiver TX0+ TX0TX01+ TX01TX02+ TX02TC+ TC- Outside World Outside World PESD Devices PESD Devices 2 PESD1206Q Arrays GND Chassia GND Chassia Table E2 Dimensions for ESD Devices in Millimeters (Inches)* A Part Number PESD0402-140 Min. 0.90 (0.035) PESD0603-240 1.50 (0.059) PESD1206Q-240 3.10 (0.122) Max. 1.10 (0.043) 1.70 (0.067) 3.30 (0.130) Min. 0.23 (0.009) 0.45 (0.018) 0.40 (0.016) B Max. 0.43 (0.017) 0.55 (0.022) 0.60 (0.024) Min. 0.10 (0.004) 0.10 (0.004) 0.10 (0.004) C Max. 0.30 (0.012) 0.50 (0.020) 0.30 (0.012) Min. 0.40 (0.016) 0.70 (0.028) 1.50 (0.059) D Max. 0.60 (0.024) 1.00 (0.039) 1.70 (0.067) 0.20 (0.008) 0.60 (0.024) 0.20 (0.008) 0.60 (0.024) E7 -- -- -- -- E6 Min. -- E Max. -- Min. -- F Max. -- Figure E6 7 *The dimensions in inches are rounded approximations. Figure E6-E7 Dimension Figures for ESD Devices Figure E6 Figure E7 D A A A A B F B C (side view) C (drawing not to scale) C (drawing not to scale) E B F E C (side view) B D Table E3 Environmental Specifications for ESD Devices Test Conditions Bias humidity test Thermal shock Bias heat test Bias low temp test Solderability Solder heat Vibration Solvent resistance Shock 85C, 85% RH, VDC (max), 1000 hrs -55C to 125C, 30 min dwell, 1000 cycles 125C, VDC (max), 1000 hrs -55C, VDC (max), 1000 hrs 250C 5C, 3 1s 260C, 10s 10 to 50Hz, 60s cycle, 2 hrs each in X-Y-Z-direction IPA ultrasonic 300s 1500G, 0.5ms each, X-Y-Z axis 3 times each axis Pass / Fail Criteria IL IL IL IL 10 A 10 A 10 A 10 A 95% coverage 90% coverage No physical damage No physical damage No physical damage RoHS Compliant, ELV Compliant HF Halogen Free 47 Table E4 General Characteristics for ESD Devices Storage temperature Operating temperature ESD voltage capability (tested per IEC 61000-4-2) ESD pulse withstand -40C to +85C -55C to +125C Contact discharge mode : 8kV (typical), 15kV (max) Air discharge mode : 15kV (typical), 25kV (max) [1 pulse: per customer request] 100 pulses (tested per IEC 61000-4-2, level 4,contact method) Table E5 Materials Information for ESD Devices RoHS compliant ELV compliant Halogen free Directive 2002/95/EC compliant Directive 2000/53/EC compliant Halogen free refers to: Br 900ppm, Cl 900ppm, Br+Cl 1500ppm Table E6 Recommended Pad Layout for ESD Devices in Millimeters (Inches)* V Part Number PESD0402-140 Min. -- Max. -- Min. 0.60 (0.024) W Max. 0.70 (0.028) 1.00 (0.039) Min. 0.30 (0.012) 0.50 (0.020) X Max. 0.40 (0.016) 0.60 (0.024) Min. 0.80 (0.031) 1.00 (0.039) Y Typ. 0.80 (0.031) Y Max. 0.90 (0.035) 1.10 (0.043) Min. 2.10 (0.083) 2.70 (0.106) Z Typ. 1.00 (0.039) Z Max. 2.20 (0.087) 2.80 (0.110) E8 Figure E8 7 PESD0603-240 -- -- 0.90 (0.035) Part Number PESD1206Q-240 V Typ. 3.20 (0.126) W Typ. 2.20 (0.087) X Typ. 0.50 (0.020) Figure E9 *The dimensions in inches are rounded approximations. Figure E8 X Figure E9 V W ZW Y Z Note: Solder thickness 0.15 to 0.2 mm X Y Table E7 Solder Reflow Recommendations for ESD Devices A Temperature ramp up 1 B Preheating C Temperature ramp up 2 D Main heating From ambient to preheating temperature 140C - 160C From preheating to main heating temperature at 200C at 220C at 240C at 260C From main heating temperature to 100C 30s to 60s 60s to 120s 20s to 40s 60s to 70s 50s to 60s 30s to 40s 5s to 10s 4C/s max Figure E10 300 Preheating Soldering Cooling Temperature (C) 250 200 150 100 50 0 A B C D E E Cooling Times (s) 48 RoHS Compliant, ELV Compliant HF Halogen Free ESD Protection Devices Table E8 Tape and Reel Specifications for ESD Devices Tape Dimension EIA Mark W P0 P1 P2 A0 B0 D0 F E1 T 0402 Dimension (mm) 8.00 4.00 4.00 2.00 0.69 1.19 1.50 3.50 1.75 0.48 Tolerance 0.30 0.10 0.05 0.05 0.05 0.05 0.10 0.05 0.10 0.03 8.00 4.00 4.00 2.00 1.27 2.02 1.50 3.50 1.75 0.60 0603 Dimension (mm) Tolerance 0.30 0.10 0.05 0.05 0.15 0.20 0.10 0.05 0.10 0.03 8.00 4.00 4.00 2.00 2.02 3.62 1.50 3.50 1.75 0.75 1206Q Dimension (mm) Tolerance 0.30 0.10 0.05 0.05 0.20 0.20 0.10 0.05 0.10 0.03 Reel Dimensions (0402, 0603 & 1206Q) EIA Mark Dimension (mm) A max. N min. W1 max. W2 max. 180.0 60.5 9.5 14.0 Figure E11 EIA Referenced Taped Component Dimensions for ESD Devices P0 T P2 E1 7 A0 D0 F W B0 P1 Figure E12 EIA Referenced Reel Dimensions for ESD Devices W2 W1 A N RoHS Compliant, ELV Compliant HF Halogen Free 49 Parameter Definitions for ESD Devices Operation Voltage (VDC) Defined as DC voltage, under which device is in OFF state and leakage current below certain threshold. Leakage Current (IL) Current through device under Operation Voltage VDC. Trigger Voltage (VT) Voltage at which the device switches from the OFF to the ON state, during the IEC waveform or the TLP system. Clamping Voltage (VC) Voltage cross device under 8 kV per IEC or measured by TLP system. Typically measured 30 ns after initiation of the ESD pulse (for TLP both 30ns and 60ns are sometimes used). , Capacitance (CP) Capacitance of the device measured at 1 MHz with 0V and max operating voltage bias. Part Numbering System for ESD Devices PESD xxxx Q - 240 Operating Voltage Designator 24 x 10 = 24VDC 7 Array of 4 Elements EIA Size Series Warning : Application Limitations for PESD0402-140, PESD0603-240 and PESD1206Q-240: These parts are not intended to be used under power bus applications. Users should independently evaluate the suitability of and test each product selected for their own application. All information, including illustrations, is believed to be accurate and reliable. Users, however, should independently evaluate the suitability of and test each product selected for their application. Tyco Electronics Corporation makes no warranties as to the accuracy or completeness of the information, and disclaims any liability regarding its use. Tyco Electronics only obligations are those in the Tyco Electronics Standard Terms and Conditions of Sale and in no case will Tyco Electronics be liable for any incidental, indirect, or consequential damages arising from the sale, resale, use, or misuse of its products. Specifications are subject to change without notice. In addition, Tyco Electronics reserves the right to make changes to materials or processing that do not affect compliance with any applicable specification without notification to Buyer. Without expressed or written consent by an officer of Tyco Electronics, Tyco Electronics does not authorize the use of any of its products as components in nuclear facility applications, aerospace, or in critical life support devices or systems. 50 RoHS Compliant, ELV Compliant HF Halogen Free |
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